Vinícius Gabriel Linden

Embedded Engineer | Firmware Developer

viniciusglinden@protonmail.com | viniciuslinden.xyz | linkedin.com/in/viniciusglinden

Full product development: from requirements to design through
documentation, prototyping, product & testing

Skills

Programming C, C++, Python, CMake, Lua, Bash, Rust, Kotlin, VHDL

Linux, RTOS, Gitlab, Continuous Integration (CI), PCB Design, SQL,
Docker, REST, OpenAPI, Automation, Agile Methodology, FPGA

Occupation

Mar 2024 - Present Bridgecom Semiconductors GmbH, Dresden, Germany

• Senior Firmware Developer
• Worked with custom silicon for 5G User Equipment (UE)
• Infrastructure firmware development in an RTOS context
  • Productive code worked in C, C++ with build written in CMake
  • Driver, maintaining and other supporting modules implementation
• Testing infrastructure framework (unit-test, simulation, on-chip)
  • Unit test done with C++ (Google Test) and Python (white box testing)
  • Simulation based on toolchain provider simulator coupled with RTL simulator
  • On-chip based on Lauterbach TRACE32 hardware debugger
    and testing server implemented in Python running inside RTOS
• Gitlab CI changes and setup

Jul 2021 - Jan 2024 nubix Software-Design GmbH, Dresden, Germany

• Hardware and Firmware Developer
• Developed multiple projects
  • IoT, industrial application, research
• Product requirements
  • Specified requirements, choose of hardware components, documentation
• PCB design and prototyping
  • PCB prototype developed in Eagle
• Communication protocol specification, implementation and testing
  • Designed a custom protocol for two microcontrollers integration
• Project build and documentation automation with Bash
• FPGA planning and development for an industrial DSP application
  • Full VHDL project developed on a Lattice FPGA
• CI setup
  • Both with Jenkins and Gitlab

Apr 2018 - Aug 2020 itt Chip, São Leopoldo, Brazil

• Engineer
• Research project involving FPGA and Flash Memory
• Hardware component requirement estimation
• VHDL coding for FPGA
• Part of the Master thesis

Mar 2016 - Mar 2018 AGCO Corporation, Canoas, Brazil

• Intern
• Newly created Hardware-In-the-Loop (HIL) lab
  • Testing software functionality, requirements and Functional Safety
• Built and automated new HILs for agricultural machinery
• Machine software support
• Machine testing (in lab and in field)

Sep 2015 - Jun 2016 Modelab, itt Chip, São Leopoldo, Brazil

• Undergraduate Student Researcher
• Simulation with ANSYS tools targeted for EMC reduction for a commercial product
• Electromagnetic properties analysis

Apr 2015 - Jun 2015 G2ELab, Grenoble, France

• Intern
• Wrote Finite-Element Analysis software in Matlab for motor vibration analysis
• Part of the Master I thesis

Education

Aug 2018 - Aug 2020 Unisinos University, São Leopoldo, Brazil

• Electrical Engineering Master Student
• Publication on HDL architecture
• Full scholarship

Feb 2014 - Jun 2015 Université Grenoble Alpes, Grenoble, France

• Master I Student
• Électronique Électrotechnique et Traitement du Signal:
  Systèmes d’Énergie Électrique
• Full scholarship during graduation studies

Feb 2012 - Aug 2018 Unisinos University, São Leopoldo, Brazil

• Electronic Engineering Graduate Student

Others

Residence

Dresden, Germany

Languages

Professional level German, French

Proficient level English, Portuguese

Citizenship

EU, Brazilian